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TI takes low-power MCU line to 32-bit with an ARM core

Texas Instruments has introduced the 32-bit MSP432 microcontrollers. The numbering scheme links to the company’s low-power MSP430 16-bit series: however, the new parts employ ARM cores and are based around Cortex-M4F.


Toshiba claims first for 48-layer BiCS: a 3D stacked structure flash memory at 16 GB

Toshiba has announced the development of the world’s first 48-layer three dimensional stacked cell structure flash memory called BiCS, a 2-bit-per-cell 128-Gigabit (16 GigaBytes) device. Sample shipments of products using the new process technology start immediately.

T&M and sensors

Highly-integrated IO-Link temperature sensor reference design

Maxim Integrated’s IO-Link smart temperature sensor reference design lowers cost and increases uptime for industrial control and automation; the company says it is more flexible, robust, and lower cost than any discrete alternative

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