3D IC Development Needs Innovative Socket Solution

April 06, 2011 // By Ila Pal - Ironwood Electronics
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stacking in one package, package-in-package stacking or package on package stacking. Each method has its pros and cons. Read this paper to learn more.
Ironwood Electronics, 3-D packaging