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BCM array with vertical mount heatsink

The Brick Business Unit of Vicor has introduced the VI Brick BCM Array. The product is a high-efficiency, high power, vertically mounted BCM array that provides isolation and conversion from 380V to 12 or 48V for low voltage distribution near POL (point-of-load). It incorporates the technical attributes of V-I Chip technology in a robust package and features output power of 650W. The product features a combination of a high voltage bus converter and an integrated heatsink. The device is available with 384 and 352V nominal input voltages, and output voltages of 11, 12, 44 and 48VDC. The efficiency and compact size of these modules yield power density of up to 290W/in3 and fast transient response. The vertical package orientation provides better exposure of the heatsink to system airflow. The offline power can be bussed to a motherboard and converted to either 48 or 12V. This feature minimises distribution losses, reduces conversion steps, improves efficiency and reduces overall cost. The product is suitable for applications that require high efficiency, high power density, improved thermal management, low noise, fast transient response and overall design flexibility.