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For the record 2/1/2012
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Toshiba Electronics has announced three bridge chips for use in mobile phones: a MIPI (Mobile Industry Processor Interface) CSI (camera serial interface) to an MDDI (Mobile Display Digital Interface) chip (the TC358740XBG) and two MDDI-MIPI DSI (display serial interface) chips (the TC358760XBG and TC358761XBG). These products provide high-speed serial interfaces between a mobile phone’s baseband or application processor and the phone’s display or integrated camera. They will also find use with highresolution displays and cameras used in smartphones, mobile Internet devices, netbooks, smartbooks and other high-performance mobile devices. The TC358740XBG camera bridge chip supports MDDI 1.2 Type 2 on the host side. The device offers support for one or to two cameras, with the primary camera employing a MIPI link and the secondary camera using a MIPI link or parallel port. The bridge enables highspeed serial interfaces on the host side via MDDI and the camera side via MIPI CSI-2, allowing support for a primary camera of up to 12 Mpixel and a secondary camera of up to 2 Mpixel in one handset. The TC358760XBG and TC358761XBG display bridges are optimised for mobile handsets using an MDDI high-speed serial digital packet host interface and provide connectivity of MIPI display panels to baseband or application processors using an MDDI interface.