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IC design

Intel & Micron to move new class of non-volatile memory to production

Intel and Micron have disclosed that they are to commence production on new class of non-volatile memory, calling it the first new memory category in more than 25 years. 3D XPoint (say; cross-point) technology brings non-volatile memory speeds “up to 1,000 times faster than NAND”.

Consumer

Article: Handling privacy and security concerns in the IoT: Protecting data

This is the third part of a series of short articles; part 1, Handling Privacy and Security Concerns in the IoT: The Importance of Identity and part 2, Handling privacy and security concerns in the IoT: Big Data and Privacy can be found from the links at the end of this instalment.

Power Management

Porous copper builds high-dissipation, low profile heatsinks

Materials specialist Versarien has developed heatsink products in which a microporous structure maximises surface area and enables more effective heat dissipation in space constrained designs.

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