Texas Instruments has introduced the 32-bit MSP432 microcontrollers. The numbering scheme links to the company’s low-power MSP430 16-bit series: however, the new parts employ ARM cores and are based around Cortex-M4F.
Toshiba has announced the development of the world’s first 48-layer three dimensional stacked cell structure flash memory called BiCS, a 2-bit-per-cell 128-Gigabit (16 GigaBytes) device. Sample shipments of products using the new process technology start immediately.
Maxim Integrated’s IO-Link smart temperature sensor reference design lowers cost and increases uptime for industrial control and automation; the company says it is more flexible, robust, and lower cost than any discrete alternative