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FETs increase thermal conductivity

Texas Instruments has introduced a family of standard-footprint power MOSFETs that dissipate heat through the top of the package for high-current DC/DC applications. DualCool NexFET power MOSFETs reduce end equipment size, while providing up to 50% more current through the MOSFET and improving thermal management over other standard-footprint packages. Key features of the devices include: single phase 35-A synchronous buck converter MOSFETs, using single MOSFETs for both the high-and-low-side switches in highcurrent DC/DC applications; enhanced packaging technology reduces thermal impedance to top of package from 10 to 15°C per watt to 1.2°C per watt; efficient dual-side heat sinking enables up to 50% more current through the FET; and SON packaging with a 5x6-mm footprint eases design and keeps cost down.

Texas Instruments, http://www. ti.com/ww/en/analog/dualcool/index. shtml?DCMP=hpa_pmp_dualcool&HQS= Other+BA+dualcool-bhp