• RF A/D converter samples inputs to 2.7 GHz 15/7/2011

  With a series of analogue/digital converter ICs from National Semconductor you can approach many radio design exercises in a new ....

  Reference design suits home and building automation systems 4/6/2011

  Silicon Laboratories has released an energy-efficient wireless sensor node solution, which is powered by a solar energy harvesting source. The company claims that the turnkey energy harvesting reference design enables developers to implement self-sustaining ....

  Silver box reference design complies with 80 PLUS platinum standard 26/4/2011

  Infineon Technologies has developed a silver box reference design that is based on the latest generation of three ICs. The IFX90ATX300W reference design also meets 80 PLUS Platinum, a high energy efficiency standard. The design contains three components ....

  Tek adds latest MIPI specs to oscilloscopes’ interface test menu 14/4/2011

  Tektronix has announced two new versions of its performance oscilloscope families in the 500 MHz to 8 GHz range; the DPO7000C Series and new 4-, 6- and 8-GHz models in the MSO/DPO/DSA70000C ....

  Optical interconnect is coming to FPGAs 29/3/2011

  Calling the disclosure a technology announcement – in other words, no specific product introductions or release dates have been revealed – Altera has described work-in-progress to add optical interconnect ....

  Tek focuses on mid-range price/performance with 2-GHz scope launch 7/12/2010

  In its latest oscilloscope announcement, Tektronix has focused on the mid-range, 350 MHz to 2 GHz, segment of the market, and has introduced a new mixed-signal ’scope range, together with a series ....

  Hall encoders enable three dimensional tilt sensor applications 9/11/2010

  Austriamicrosystems has announced the AS540x product family of three-dimensional Hall encoders. The three-dimensional Hall element is able to provide enhanced resolution with angular or linear output ....

  Online resources support electronics design engineering 8/11/2010

  RS Components has announced that at Electronica this year it will showcase design resources available online for the global electronics design engineering community. The company will be in Hall A4, on stand ....

  Xilinx adopts stacked-die 3D packaging 1/11/2010

  Xilinx has announced that several of the highest-density parts in its forthcoming Series 7 FPGAs will be constructed using multiple dice in one package, employing technology ....

  Video decoder/audio codec SoC 21/10/2010

  Maxim’s 4-channel video decoder SoC allows direct connection to its family of H.264 processors, reducing cost by more than $1 per channel. Added to a set of products for the digital video ....

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