Intel Core2 Duo processor-based SBCs
EDN Europe, 29 Jun 2009
Curtiss-Wright has introduced the VPX3-1252, the latest member of the company’s family of high performance Intel Core2 Duo processor-based VPX SBCs (single board computers). The SBC features a small form factor, low voltage Intel Core 2 Duo processor SP9300. The SBC delivers 2.26GHz performance from each of its dual cores and provides advanced Intel architecture processing in a lightweight, compact configuration. The fully featured 3U SBC is designed for harsh-environment, air- and conduction-cooled aerospace and defence applications. The small form factor SBC is suitable for SWaP (space, weight and power) constrained applications, such as deployed network-centric communications, vehicle management and graphics/video display systems. The SBC is a combination of high performance x86 and rugged small form-factor computing. It combines low power and advanced I/O capabilities to provide a processing platform that addresses a wide range of embedded applications. The SBC occupies a single standard 3U 0.8inch slot and can be used for upgrading existing cPCI (CompactPCI) systems in the same footprint.

The SP9300 processor delivers significantly enhanced energy-efficient performance. The processor integrates two complete execution cores in one physical package and provides advancements in simultaneous computing for multi-threaded applications and multi-tasking environments. Intel’s hafnium-based 45nm Hi-k silicon process technology enables even more processor performance by doubling transistor density and increasing cache size by up to 50%. The SP9300 is validated with the Mobile Intel GS45S chipset. The SBC is available in a full range of environmental build grades. The SBC is available with up to 4Gbyte of high-bandwidth DDR3 SDRAM and comes with a rich complement of high-speed I/O, including dual Gigabit Ethernet, three USB 2.0 ports, and an XMC site that is supported with eight lanes of PCIe (PCI Express). The board’s integral high-speed Gigabit Ethernet, PCIe Fabric and XMC mezzanine module connectivity enables high bandwidth data flows. Data can also flow from the VPX backplane to the XMC site to support demanding high bandwidth applications. This platform provides graphics core performance up to 533MHz.