- BY ROBERT CRAVOTTA• TECHNICAL EDITOR
DESIGNERS ARE ADDING SENSORS AND INTELLIGENT PROCESSING TO FILL THE HOLES IN THEIR END SYSTEM CAPABILITIES, AND IT IS YIELDING DESIGNS THAT ARE LESS COSTLY TO PRODUCE AND OPERATE.
- By Paul Rako
- By Robert Cravotta
- By Graham Prophet
- By Graham Prophet
- By Graham Prophet
- By Paul Rako
- By Robert Cravotta
- By Margery Conner
- By Margery Conner
- By Paul Rako
- y Paul Rako
- By Robert Cravotta
- BY GRAHAM PROPHET, EDITOR
- By Rick Nelson, Editor in Chief, Test & Measurement World
- By John Titus, Contributing Technical Editor, Test & Measurement World
- MARGERY CONNER • TECHNICAL EDITOR
Carlos Alberto Aguilar Sández, Centro de Estudios Superiores del Estado de Sonora, Unidad sede San Luis Rio Colorado, Sonora, Mexico
- Guus Colman, Guy Torfs, Johan Bauwelinck, and Jan Vandewege, INTEC/IMEC, Ghent University, Ghent, Belgium
- Israel Schleicher, Prescott Valley, Arizona
- BY WARREN WEBB • TECHNICAL EDITOR
AS NEW EMBEDDED DESIGNS MIX HIGHLY INTEGRATED SILICON, PORTABLE PLATFORMS, AND SOARING DATA RATES, THE INDUSTRY IS ADOPTING SMALLER FORM FACTORS THAT EMPHASIZE COOLING, RELIABILITY, AND PERFORMANCE.
- BY BARRY HARVEY • INTERSIL SEMICONDUCTOR
VIDEO AMPLIFIERS HAVE UNIQUE AND DEMANDING SPECIFICATIONS. UNDERSTANDING THEM WILL HELP YOU SELECT AN AMPLIFIER THAT CAN DO THE JOB.
- BY DR ERIC SWEETMAN • VITESSE SEMICONDUCTOR
A SYSTEMATIC APPROACH USES DSO-BASED TDR AND TDT MEASUREMENTS TO CONSTRUCT MODELS WHOSE SIMULATED RESPONSE DISPLAYS AN UNCANNY RESEMBLANCE TO THE RESPONSE OF THE REAL HARDWARE.
- by Dan Strassberg