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Low-frequency RF IDIC package for direct coil mounting

Atmel Corporation has announced the availability of a small XDFN (extremely thin dual flat no leads) package including a 363bit read and write transponder IDIC. The transponder IDIC ATA5577M1 is a high-volume low-frequency of 100 to 150kHz RFID device designed for small tag applications including animal ID ear and bolus tags, standard key fobs or clamshell cards for access control solutions. The XDFN package measures 2x1.5x0.37mm. The two coil wires can directly be soldered onto the two pads of the package and mounted or glued onto the antenna coil. Since the chip has a 330pF on-chip capacitor trimmed to ±3%, the antenna coil is the external component required to form a trimmed LF-RFID tag, claims the company. Handling the chip is not necessary and the requirements for the environmental conditions during production are claimed to be less stringent. Packing of the chip using PCB boards or micromodules is no longer necessary, thus reducing production steps, according to the company.

The incorporated chip is claimed to provide a manufacturer-programmed and locked unique ID which enables the traceability of the product to prevent cloning or counterfeiting of the tag IC. The ID and the extended read and write distances have been optimised for next-generation access control applications including hotel rooms, engineering departments, offices, time recording systems, parking lots, customer loyalty and membership cards. In addition, the chip operates according to ISO 11784 and ISO 11785 FDX-B standards. The chip is not sensitive to rugged environments and can also be used under conditions that normally complicate the application of RFID devices, such as water, metal, dirt, or being applied to the body.