The announcement comprises four items including the low-profile multilayer ceramic capacitors - JMC063 BJ224MH, 0.6 x 0.3 x 0.15 mm and JMK063 BJ224MH - 0.6 x 0.3 x 0.15 mm, with the height value beingthe maximum in each size).
These multilayer ceramic capacitors are used for the decoupling of IC power supply lines in small and thin devices, such as smartphones and wearable devices, and as various modules characterised by copper core embedded-parts multilayer wiring substrate, for which Taiyo Yuden has the brand name “EOMIN”.
Maximum capacitance value is 0.22 μF. The conventional product lineup, says the company, of such low-profile multilayer ceramic capacitors is a height of 0.15 mm – including and up to the EIA 0402 size. This announcement reduces the size up to EIA 0201, a reduction of 64% in the mounting area while retaining the same thickness. Copper plating that is suitable for mounting the capacitors on embedded-parts multilayer substrates is available in these components.
The caters for the need to implement high-density mounting, which includes mounting inside or at the back of the IC package and the use of the embedded-parts multilayer substrate technology in which the capacitor is embedded into the substrate.
Taiyo Yuden; www.taiyo-yuden.com