AVX' low-profile 0603 diplexer is based on the company’s patented multilayer organic high density interconnect technology; the 0603 MLO diplexer employs high dielectric constant and low loss materials to realise high-Q passive printed elements, such as inductors and capacitors, in a multilayer stack-up. Capable of supporting multiple wireless standards, including: WCDMA, CDMA, WLAN, GSM, and BT, the 0603 diplexers are ideally suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS, and cellular bands.
In land grid array packaging, AVX’s 0603 diplexers have an inherently low profile (<0.5mm) and exhibit excellent solderability, low parasitics, and high heat dissipation. Expansion-matched to PCBs, the diplexers also provide improved reliability compared to comparable ceramic or silicon components.
The diplexer features a maximum power capacity of 4.5W, measures 1.65 x 0.88 x 0.42 mm, is rated for use in temperatures ranging from -40°C to +85°C, and is available in Ni Au, Ni Sn, and OSP finishes, all of which are compatible with automatic soldering technologies. Finished parts are 100% tested for electrical parameters and visual characteristics.