100-Ohm backplane connector will support 25 Gbps data rates

January 21, 2014 // By Graham Prophet
A range of modular backplane connector features low mating force and a 1.90 x 1.35 mm pitch for optimal performance in traditional backplane and midplane architectures.

Molex’ Impact 100-Ohm backplane connector offers speed and density in a modular package designed for high speed applications, with data rates up to 25 Gbps and signal density up to 80 differential pairs per linear inch when using a 6-pair configuration.

The Impact backplane connector is suitable for high speed networking equipment and storage servers in the data and telecommunications, medical, military and aerospace industries and conforms to IEEE 10GBASE-KR and OIF Stat Eye Compliant end-to-end channel performance.

With a 1.90 x 1.35 mm grid, which reduces PCB routing complexity and cost, the broad-edge coupled, differential-pair Impact backplane system supports high bandwidth needs while minimising board and system real estate usage. Compliant pin attach options (0.39 and 0.46 mm) provide the flexibility to optimise designs for superior mechanical and electrical performance in traditional backplane or midplane architectures. The Impact daughtercard mating interface uses an in-line staggered, bifurcated contact system that reduces the mating force per pin and provides ground-signal sequencing without the need for multiple backplane signal-pin heights.

Available in conventional, coplanar, mezzanine, orthogonal and orthogonal direct configurations, signal module options vary by configuration and are offered in two to six 6 pairs. Power modules are available in three to six pair sizes in conventional, coplanar and mezzanine configurations with current ratings from 60.0 to 120.0 A per module.

Molex; www.molex.com/link/impact100ohm.html