The SWIFT TPS53915 converter occupies a PowerStack QFN package and has integrated NexFET MOSFETS to drive loads such as ASICs in space-constrained and power-dense applications. Used in conjunction with TI's WEBENCH online design tools, the TPS53915 simplifies power conversion and speeds the design process.
The highly integrated converter features 0.5% reference voltage accuracy to meet voltage requirements of deep sub-micron processors. D-CAP3 adaptive on-time control mode provides very fast load transient response and reduces external component count. Programmability and fault reporting via PMBus simplifies power supply design and further reduces component count. A video demonstration of the TPS53915 is here.
- Integrated high- and low-side MOSFETs support 12-A continuous output current.
- On-chip PMBus interface simplifies power supply design.
-D-CAP3 adaptive on-time control mode eliminates output capacitors and requires no loop compensation, which minimises the external component count.
- Auto-skipping Eco-mode provides high light-load efficiency.
- the 28-pin, 3.5-mm by 4.5-mm by 1-mm PowerStack QFN package features TI's NexFET power MOSFETs stacked on a grounded lead frame and connected using copper clips. The unique combination of stacking and bonding allows for a smaller, more integrated quad flat no-lead (QFN) package compared to other solutions that place MOSFETs side by side. A video on PowerStack package technology is here.
Other features include no external compensation, internal soft start, input under-voltage protection, internal bootstrap capacitor and thermal shutdown.
Texas Instruments; www.ti.com/TPS53915-pr