The TO-220FP wide creepage package is suitable for the power transistors of open-frame power supplies commonly used in equipment such as television sets and PCs, which are vulnerable to surface contamination by dust and particles that can cause high-voltage arcing between transistor terminals. The package’s extended lead spacing of 4.25 mm eliminates the special potting, lead forming, sleeving, or sealing needed to prevent the arcing when using conventional packages with 2.54 mm lead spacing. Power-supply manufacturers can now meet applicable safety standards and minimize field failures, ST says, without applying these additional processes, thereby simplifying manufacturing and enhancing productivity.
While providing superior arcing resistance, TO-220FP wide creepage retains the electrical properties of the popular TO-220FP. Similar outer dimensions ensure compatibility with established assembly processes.
ST developed the TO-220FP wide creepage package by collaborating with its customer SoluM, a power manufacturer based in Korea. SoluM is using the superior package to create new power solutions that are more robust and cost-effective than competing products.
ST is currently ramping up production of TO-220FP wide creepage power transistors to support a major global television manufacturer. The product portfolio includes four fully qualified 600V low-R DS(ON) MDmesh M2 MOSFETs with current ratings from 8A to 34A. The 1500V STFH12N150K5 and 1200V STFH12N120K5, MDmesh K5 devices, will be qualified by the end of Q3 2016.