The new memory devices are compliant with the latest e∙MMCTM standard, and are designed for a wide range of applications including smartphones, tablet PCs and wearable devices. Sample shipment of the 16GB devices start from today, with 8GB, 32GB, 64GB and 128GB products to follow.
The e∙MMC NAND chips are fabricated using Toshiba's 15nm process technology and the devices integrate a controller that manages basic control functions for NAND applications. By utilizing the 15nm NAND chips, the package size is approximately 26% smaller than the company’s previous products.
The 153-ball FBGA packages are suitable for use in smartphones, tablet PCs and wearable devices where miniaturization and weight savings are key requirements. The 16GB e∙MMC NAND chips are available in several package sizes, 11.5x13.0x0.8mm, 11.0x10.0x1.0mm and 11.5x13.0x0.8mm.
The 8GB, 32GB and 64GB devices are also available in the 11.5x14.0mm and 11.0x10.0mm formats. Embedded in a system, the 128GB device (THGBMFT0CBLBAIS) measures 11.5x13.0x1.4mm and can record up to 16.3 hours of full spec high definition video and 39.7 hours of standard definition video.
Read speed is approximately 8% faster while the write speed is approximately 20% faster than on the company’s previous devices.
Visit Toshiba Electronics Europe at www.toshiba-components.com