16-bit microcontrollers extend Renesas' automotive systems offering

September 12, 2013 // By Christoph Hammerschmidt
Renesas Electronics has introduced the RL78/F13 and RL78/F14 16-bit microcontrollers (MCUs) that contribute to enhanced development efficiency, reduced system costs, lower system power consumption and improved functional safety features for automotive control systems.

The new MCU product line consists of total of 91 products including 60 products in the RL78/F13 Group and 31 products in the FL78/F14 Group. The RL78/F13 MCUs are designed for use in a wide range of automotive applications; from body control systems such as power window and side mirror control, to automotive motor control systems such as electric water pumps and cooling fans. The RL78/F14 MCUs support the body control system applications, such as BCM (body control module) and HVAC (heating, ventilation, and air conditioning) control that require especially large memory capacities.

Key features of the RL78/F13 and RL78/F14 MCUs include:

· Extensive product lineup that supports easy platform standardisation contribute to development efficiency. To support needs such as the ability to change ROM sizes due to difference in system specifications to supporting reuse in a completely different system, the new MCUs all integrate the same CPU core, peripheral functions including automotive networks such as CAN and LIN, and pin layout. Thus, these MCUs support a wide range of applications. This enables the construction of a development platform based on the reuse of design assets such as software and printed circuit boards which contribute to increased development efficiency of the overall systems. The RL78/F13 and RL78/F14 MCUs also adopt the high-functionality MCU peripheral functions of the existing Renesas' 78K0R and R8C CPU cores.

· Compact package and support for high-temperature operation up to 150°C allow reduction of the overall unit size. Renesas has developed a new QFN package to respond to needs for even more compact ECUs. When compared to Renesas’ existing 32-pin SSOP, the new QFN package can reduce mounting areas by approximately 69%. Compared to Renesas’ existing QFN packages, the new QFN package has indentations on the pin side surface to improve solder wettability during mounting. This makes it possible to mount the new MCU devices without making any changes to the factory production line. The adoption