TO-220 wide creepage package simplifies build with 600V FETS

April 27, 2016 // By Graham Prophet
Infineon Technologies' TO-220 FullPAK wide creepage package is an option for the company's 600V CoolMOS CE devices, targeting a broad range of low power consumer applications. It has been developed to meet the demanding requirements of open frame power supplies where pollution might lead to arcing failures.

The TO-220 FullPAK wide creepage replaces frequently-used workarounds to increase creepage distance such as silicone potting, the usage of sleeves, pre-bending of leads or others. Offering a better alternative to workarounds, customers profit from reduced system costs when implementing the new package.


The package targets open frame power supplies such as TV adapters where dust can enter the case through air vents. These dust particles can reduce the effective creepage between pins over time which may lead to high voltage arcing. The package comes with a pin distance of 4.25 mm instead of the prevailing 2.54 mm found in a standard TO-220 FullPAK package.


The other outer dimensions of the new package are almost identical to the TO-220 FullPAK. The Wide Creepage package retains the benefits of a standard FullPAK, such as isolation behaviour and compatibility with automated assembly.