The OBT is designed to be placed near a host ASIC which results in shorter copper board traces, better signal integrity and lower power consumption. The transceiver is connected to the board via an FCI proprietary surface mount electrical BGA/LGA socket.
Optical connectivity to-and-from the OBT is realised by using a high-density ribbon fibre assembly connecting to the front panel with an optical connector system such as the MPO or MXC connector and adaptor. A standard MT ferrule is used on the transceiver side.
This next generation of product has been engineered with the latest 850 nm VCSEL and PIN array technology operating at 25 Gb/sec along with the latest 25 G/sec laser driver and TIA chip set . The design is optimised for low power consumption resulting in a total typical power consumption of 2.7W without CDR and 5.4W with CDR.
“FCI’s Leap On-board Transceiver design addresses a number of emerging industry trends and hardware designer needs,” stated Roy Muscarella, VP and General Manager of the High Speed Input/Output Solutions Group. “These trends and needs, such as increased IO port density, minimised PCB real estate use, lower copper trace losses on the PCB and the need for 25 Gb/sec capable channels, are all addressed in the OBT package.”
Evaluation kits are available upon request. The product is scheduled to be available in the second half of 2015.