The PSoC 4 BLE Programmable System-on-Chip and PRoC BLE Programmable Radio-on-Chip solutions each now have an option for a micro-ball Chip Scale Package (CSP) package optimised to bring Bluetooth Smart connectivity to secure credit card applications. The package is only 0.38-mm thick, enabling the Bluetooth-certified solutions to replace chip-on-board devices.
Cypress also offers products with an extended industrial temperature range option with operation from -40ºC to +105ºC. This ensures consistent product performance throughout this temperature range for industrial, automotive and lighting applications that must operate in extreme climates. Both the micro-ball CSP package and extended industrial temperature options will be available for the 128 kB and 256 kB flash versions of the PSoC 4 BLE and PRoC BLE solutions. The new offerings are pin-to-pin compatible with Cypress’s original Bluetooth Low Energy solutions, simplifying upgrades.
“Bluetooth Low Energy is quickly expanding its market reach....” said Jayant Somani, senior director of Bluetooth Low Energy products at Cypress. “... CSP and temperature options bring the ease-of-use, programmability and robust, low-power performance of our PSoC 4 BLE and PRoC BLE solutions to an even broader range of customers.”
Cypress’s customisable Bluetooth Low Energy solutions offer integration for IoT applications, home automation, wireless Human Interface Devices (HIDs), remote controls, healthcare equipment, sports and fitness monitors, and other wearable smart devices. PRoC BLE is a Bluetooth Smart microcontroller with Cypress’s CapSense capacitive touch-sensing functionality, while PSoC 4 BLE offers expanded design versatility by adding intelligent analogue and programmable digital blocks. Both solutions integrate a Bluetooth Smart radio, a high-performance 32-bit ARM Cortex-M0 core with ultra-low-power modes, up to 256 kB flash memory, 36 GPIOs, and customiseable serial communication blocks, timers and counters. Both solutions have an on-chip balun that simplifies antenna design while reducing board size and system cost.