Advanced die packaging technology cuts RF module footprint by 75%

August 24, 2012 // By Julien Happich
A new die packaging technology developed by Microsemi Corporation has passed an internal qualification regime typical for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards.

The die packaging technology is targeted at implantable medical devices such as pacemakers and cardiac defibrillators. It can also be used in wearable devices such hearing aids and intelligent patches, as well as nerve stimulators and drug delivery products. Delivering a footprint reduction of approximately 75 percent over the company's currently available implantable radio modules, the small technology allows physicians to use less invasive procedures, enabling faster recovery times and improvements in patient comfort while concurrently lowering health care costs. Smaller, lighter weight wireless medical devices also afford patients greater mobility. This packaging technology can also be paired with Microsemi's ultra low-power ZL70102 radio to enable wireless healthcare monitoring. The ZL70102 transceiver chip supports a very high data rate RF link for medical implantable communication applications in the 402-405 MHz MICS band.

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