Altera, Intel to work on development of multi-die devices

March 27, 2014 // By Graham Prophet
Altera and Intel – the two companies already have a manufacturing partnership – have announced a collaboration to optimise integration of 14-nm Tri-Gate (the Intel term for Fin-FET) Stratix 10 FPGAs with heterogeneous technologies into a single system-in-a-package

In other words, the two will explore mounting non-identical dice with a range of features and functions, within a single package. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera’s Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process.

Altera’s work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analogue components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera says its heterogeneous multi-die devices match the results from conventional 2.5D (dice mounted side-by-side on a interconnect substrate) and 3D (dice mounted atop each other and either directly interconnected or connected via interposers) approaches, with more favourable economic metrics. The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments.