ARM and UMC expand scope of IP offerings for advanced SoC designs

January 14, 2014 // By Graham Prophet
ARM and UMC are now to jointly offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology, for customers in a wide range of consumer applications such as smartphone, tablet, wireless and digital home.

UMC comments that its 28-nm dual process roadmap includes both poly SiON and High-K/Metal Gate based technologies, asserting that its 28HLP is the foundry industry’s most competitive Poly SiON 28nm technology in terms of power consumption, performance and area.

The energy-efficient ARM Cortex-A7 processor has seen broad adoption in smartphones, tablets, DTV and other consumer products. The ARM POP IP for the Cortex-A7 processor is targeted for 1.2 GHz on UMC’s 28HLP platform, and was available from December 2013.

UMC’s 28HLP process is the foundry’s enhanced 28nm Poly-SiON technology that provides an optimal balance of size, speed and power leakage. These process characteristics makes the process the optimal choice for a variety of applications that require low power consumption without compromising performance, including portable, wireless LAN, and both wired and handheld consumer products. The foundry is currently in pilot production for customer products on 28HLP, with volume production expected in early 2014.

The ARM Artisan physical IP platform for UMC’s 28nm poly SiON process provides the building blocks to implement high-performance, low-power SoC designs. ARM’s IP platform offers a comprehensive set of memory compilers, standard cells and logic, and general-purpose interface products that meet the most demanding performance and power requirements for mobile communications and computing. ARM’s standard cell libraries and memory compilers incorporate multi-channel and mixed Vt features to enable a wide performance and power spectrum.

POP IP technology comprises three key elements necessary for optimised ARM processor implementation;Artisan physical IP logic libraries and memory instances tuned for a given ARM core and process technology, comprehensive benchmarking reports pinpointing conditions and results ARM achieved for core implementation, and detailed POP implementation knowledge and methodologies. POP IP products are available from 40nm to 28nm with roadmap down to FinFET process technology for a wide range of Cortex-A series CPU and Mali GPU products.

UMC; www.umc.com

ARM; www.arm.com