LP Array high speed, low profile arrays feature a dual wipe contact system on a .050-in. (1.27 mm) x .050-in. (1.27 mm) pitch grid for maximum grounding and routing flexibility. Standard lead-free solder crimp terminations allow for ease of processing. Tin-lead solder crimp is also available. Optional pick and place pads are available for automated placement on the PCB. Other pin counts, row counts and gold plating options are also available for additional design flexibility.
Samtec’s full line of high speed, high density products includes SEARAY Open Pin Field Arrays which feature Edge Rate contacts optimised for signal integrity. The .050-in. (1.27 mm) pitch system is available with up to 500 I/Os in stack heights from 7 mm to 40 mm. Right angle for micro backplane applications and press fit tail options provide greater system flexibility. A 0.80-mm (.0347-in.) pitch system offers up to a 50% board space savings with 7 mm and 10 mm stack heights. In addition, DP Array Differential Pair Arrays provide perimeter grounds and staggered pin layout to eliminate interstitial grounds and make board routing easier with performance up to 1 terabit per connector.