Automated 3D solder paste optical inspection

May 14, 2012 // By Julien Happich
Goepel electronic introduced a brand-new system for 3D solder paste inspection (SPI) named the OptiCon SPI-Line 3D.

It provides high level technology by extraordinary inspection speed and detection accuracy for automatic solder paste inspection

The new SPI system will be offered in three different configurations determined by pixel resolutions of 10 µm, 15 µm and 20 µm. The machine can inspect up to 90cm²/s. 

The OptiCon SPI-Line 3D is fully compliant to all OptiCon AOI systems from the manufacturer, allowing for hitherto unknown opportunities in PCB production process optimization. Core element is a specifically developed 3D camera head functionally based on the fringe projection principle, operating without moving parts. In connection with a newly designed drive system for assemblies and measuring head a reliable monitoring of the solder paste printing at extraordinary speed is guaranteed.

The completely new developed user interface SPI-Pilot provides an efficient, reliable and simple programming. An offline programming station and a module for statistic process control (SPC) evaluation are offered as add-on options.

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