Valens (Hod Hasharon, Israel) and STMicroelectronics have announced a collaboration to bring HDBaseT Automotive into the next-generation of connected cars. The highly efficient technology optimizes in-vehicle connectivity by enabling the transmission of reliable 6 Gbps high-throughput infotainment, road safety, and automotive-control content over a low-cost infrastructure with near-zero latency.
HDBaseT Automotive enables the tunneling of up to 6 Gbps of video, audio, data, USB and more, with native networking capabilities over a single unshielded twisted-pair (UTP) cable for up to 15m (50 ft). HDBaseT Automotive also allows for daisy-chaining and multistreaming, to simplify and optimize in-vehicle connectivity.
Valens, as the inventor of HDBaseT and founder of the HDBaseT Alliance, brings the technology and expertise to accomplish the goal of commercializing HDBaseT-enabled vehicles. STMicroelectronics will contribute its extensive design and manufacturing experience and know-how in compliance with the strict automotive quality and reliability requirements.
“As Valens meets significant milestones in our vision to optimize in-vehicle connectivity, we are excited to welcome ST as our major partner in pursuing this goal. ST will help us accelerate the introduction of HDBaseT Automotive to the market,” said Dror Jerushalmi, CEO, Valens.
“We can see the potential of HDBaseT Automotive as a high-throughput, low-latency, low-cost technology. That’s why we are excited to be part of this project to help Valens bring the HDBaseT Automotive technology and devices to the market, with the highest levels of quality and reliability expected,” said Fabio Marchio, Vice President and General Manager, Automotive Digital Division, STMicroelectronics.
HDBaseT Automotive will be shown at the electronica 2016 show in Munich, on November 8th-11th, at the HDBaseT Alliance booth (Hall A6, Booth 264).