The combination of these technologies, features and options enables Fairchild to provide products with a very tight parametric distribution for both discrete and bare die solutions. The FGY160T65SPD_F085 and FGY120T65SPD_F085 discrete IGBTs are aimed at traction inverters and other HEV/PHEV/EV powertrain components that require high power density and high reliability. “They undergo extra screening at final testing that addresses the specific needs of traction inverters applications and is applied to 100% finished goods,” explained Fabio Necco, Director of the H/EV product line at Fairchild. “Along with a best-in-class 650V breakdown voltage, which is 50V higher than existing solutions, this extra step provides further protection against electrical overstress.”
The process technology employed yields close matching of key parameters such as gate threshold and saturation voltages, allowing you, Fairchild says, to parallel the devices without selecting or binning parts, adding IGBTs as needed to achieve the required system power rating, while also improving the overall efficiency of traction inverter or other powertrain component designs. Breakdown voltage is also maintained to high temperatures (rather than being de-rated) which adds to reliability. In bare-die form, current ratings can be up to 300A.
Fairchild is also announcing the PCGA200T65NF8, PCRKA20065F8, PCGA300T65DF8, and PCRKA30065F8 bare die IGBTs and diodes for automakers and automotive parts suppliers building their own power modules for high-performance traction inverters and other motor-driving components. Bare die IGBTs are also available with integrated monolithic current sense and temperature sense to provide additional levels of protection.
The bare die IGBTs can be customized to meet special requirements. Options include changing the gate pad size and location to accommodate different diameters of aluminium wire, resizing the die, and customizing the breakdown voltage and other electrical parameters. A solderable top metal version is also available and is designed for advanced wire bondless assembly technologies such as soldering technologies as sintering.
Fairchild is also expanding its portfolio with a new automotive-grade module currently