Automotive MCU drives hybrid instrument clusters HUDs & dials

August 25, 2016 // By Graham Prophet
Cypress’ latest Traveo microcontroller family integrates a 2D graphic engine with LVDS output and expanded onboard memory; it is designed to support hybrid instrument cluster applications.

The integrated devices in the S6J32xE series provide a single-chip solution that can drive graphics on head-up displays or traditional gauges, but also provides scalability with Cypress’s low-pin-count HyperBus memory interface.


The Traveo S6J32xE series hosts up to 4 MB of high-density embedded flash, 512 KB RAM and 2 MB of Video RAM, along with an ARM Cortex-R5 core at 240 MHz performance. The MCUs have up to two 12-pin HyperBus memory interfaces that improve read and write performance of graphical data and other data or code. The devices can use a single HyperBus interface to connect to two memories for Firmware Over-The-Air (FOTA) updates. The series includes a LVDS video output, providing a suitable interface to attach external displays such as TFTs. The MCUs support all in-vehicle networking standards required for instrument clusters, including CAN-FD and Ethernet AVB.


These derivatives integrate enhanced secure hardware extension (eSHE) for robust security. The HyperBus interface enables seamless connections with Cypress’s HyperFlash and HyperRAM memories, which deliver read/write bandwidth of up to 200 MBps per channel in combination with Traveo MCUs. The MCUs include 50 channels of 12-bit ADC, 12 channels of multi-function serial interfaces and I ²S interfaces and an audio DAC to output sounds required in today’s instrument clusters. Support for Ethernet AVB delivers increased bandwidth in multimedia applications and reduced programming time, while a MediaLB interface enables communication with legacy media communication systems. The S6J32xE series supports an ambient temperature range of -40°C to +105°C.