TI's BLE-Stack 1.3 includes over-the-air firmware downloads (OAD), which enable updates to CC2540/1 firmware to be downloaded from a central device, such as a phone, tablet or PC onto the CC2540/1 system-on-chip (SoC) directly over the RF link. OAD support helps customers save time and simplify the software upgrade process, leaving more time to design and create new Bluetooth low energy devices and applications.
Additionally, for customers using Bluetooth low energy and proprietary implementations, TI's Boot Image Manager (BIM) allows multiple firmware stacks to reside on a single CC2540/1 SoC. BIM enables an end-product to support two different Bluetooth low energy stacks or a single Bluetooth low energy stack and a single 2.4GHz proprietary stack.
The new software features are further supported by sample applications with extensive profile support and include upgraded network processor UART and SPI interfaces for improved power management control. To further the development of new Bluetooth low energy applications, the new BLE-Stack 1.3 also runs on TI's SensorTag development kit and Mini-kit. The SensorTag development kit is supported by OAD, iOS app and the Bluetooth low energy device monitor.
Availability and Pricing
TI BLE-Stack 1.3 Bluetooth low energy application software is available royalty-free to all customers using TI's CC2540/1 Bluetooth low energy SoC family. The CC2540DKMINI, CC2540DK and CC2541EMK development kits are available on TI's eStore for $99, $299, and $99, respectively. TI's CC2541 SensorTag development kit is available on the eStore for $25.
More information about the BLE-Stack 1.3 software at www.ti.com/blestack13-pr