The kits are based on Dialog’s DA14580 and DA14581 System-on-Chip (SoC) ICs. These highly integrated devices combine a Bluetooth low energy radio with an ARM Cortex-M0 application processor and intelligent power management. Processor resources are accessible via 32 GPIOs to enable development of fully hosted applications. The SoCs measure 2.5 x 2.5 mm and need five external components to create complete solutions that consume less than half the power of alternatives.
SmartBond Basic is a single-board kit with integral flash memory for software development. The Pro version of the kit includes mother and daughter boards and a power profiler to enable power-optimised coding. Both kits are supported by Dialog’s SmartSnippets software development environment, which includes Bluetooth Smart SIG-qualified profiles ranging from proximity to health and fitness, medical, smart home, and security. Software Upgrade Over The Air (SUOTA) is supported.
SmartBond kits at Digi-Key; www.digikey.com/product-search/en?vendor=0&keywords=smartbond+development