These ultra low profile (ULP) board-to-board compression contacts, the 70-9155 series, feature a sweeping beam design that enables vertical or horizontal mating and high force, gold-plated beryllium copper contacts that maximise reliability and signal integrity, enabling lifetimes of up to 1,000 cycles. Impervious to even extreme shock and vibration, the contacts provide a rugged and reliable compression connection to the mating board and can be surface mounted to any position on a PCB, enhancing design flexibility with regard to both layout and output voltage, which directly corresponds to the distance between contacts. The individual ULP contacts are also capable of reducing both the size and cost of end-designs in a broad range of harsh environment applications, including: portable and handheld industrial devices, board-to-board power and signal connections, and ground connections between PCBs or housings.
Packaged on tape and reel for automated SMT placement, 70-9155 Series ULP board-to-board compression contacts are rated for 3A and -40°C to +125°C; voltage ratings for the individual contacts are dependent upon their placement. Currently comprised of two contacts, the 70-9155 Series is available with nominal operating heights of 1.0 mm and 1.5 mm and with contact operating height ranges of 0.75-1.25 mm and 1.25-1.75 mm, respectively. Designed for high reliability performance up to 1,000 cycles, the series features beryllium copper contacts with nickel under plates, gold on the nose, and tin on the tails. To satisfy the environmental and expected lifetime requirements of various end products, 70-9155 contacts are also available with three gold plating options: 0.1 µm for 50 cycles (standard), 0.4 µm for 500 cycles, and 0.8 µm for 1,000 cycles.