Based on the COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 Gigabytes of DDR4 ECC RAM. Examples of target applications for these Server-on-Modules are industrial automation, storage and networking appliances as well as modular server designs and base stations for telecom carriers, service providers' server farms as well as cloud, edge and fog servers for IoT and Industry 4.0 applications.
The modular core of the long-term available congatec Server-on-Modules offers a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs - accelerating the launch of new, robust server technology. Future performance upgrades are by swapping the Server-on-Module - even in case of a switch in the processor architecture.
Christian Eder, Marketing Director at congatec and editor of the COM Express 3.0 specification that includes the new COM Express Type 7 Pinout, emphasizes the significance of the new COM Express Type 7 specification Server-on-Modules: "Up to now, it was not possible to execute 10 Gigabit Ethernet natively on the modules. However, this bandwidth is required to create easily scalable, module server topologies via virtualization. The Type 7 pinout fulfils these demands. It offers up to four 10 Gigabit Ethernet ports and an impressive number of 32 PCIe lanes which are commonly used on this type of server to connect fast SSDs or discrete GPUs. The COM Express footprint is tiny and allows more cores per rack. This extremely compact and robust server technology allows 10 GbE connections to be carried into the field, which is essential for hosting IoT applications."
The conga-B7XD COM Express Type 7 Server-on-Modules come in a headless design and are available with ten different server processors: From the 16 Core Intel Xeon processor D1577 to the Intel Pentium processor D1519 for the industrial temperature