Connection headers offer greater flexibility for automotive standard interconnects

April 10, 2013 // By Christoph Hammerschmidt
Molex has introduced modular, stackable HS Stac headers that combine the high-speed USCAR-30 HSAutolink interface with the modular, stackable configuration of the versatile Stac64 connector system. With a 0.80mm pitch, the new HS Stac headers achieve greater design-flexibility and space-savings in PCB trace-routing for in-vehicle infotainment and telematics devices.

Designers wanting to use or already using the Stac64 system for I/O connections can now use HS Stac headers to create custom, ganged multi-bay headers, combining I/O with high-speed signal without expensive tooling investment, Molex says. In addition to saving costs and simplifying assembly, this allows greater design flexibility and saves space.

The automotive industry-standard interface, known as USCAR-30, supports USB 2.0 requirements and other high-speed technologies including Low Voltage Differential Signalling (LVDS) and Ethernet for infotainment, telematics devices, car stereo and navigation systems, and driver-assist electronic modules. HS Stac right-angle headers package the USCAR-30 interface found in the HSAutoLink family in a rugged, shroud-stackable formation and are stackable with the Stac64 header family, also from Molex; creating a multi-bay, high-speed connection system to meet growing in-vehicle terminal requirements for devices and modules in automotive and commercial transportation applications.

HS Stac headers mate with a range of existing HSAutoLink cable assemblies for a complete connection system.