CoolMOS CE in SOT-223 is cost-effective swap for DPAK, says Infineon

March 14, 2016 // By Graham Prophet
Infineon Technologies adds to its portfolio of CoolMOS CE power devices with an SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation.

The SOT-223 package without middle pin is fully compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK. This package targets customer designs in LED lighting and mobile charger applications.


Infineon says it has the first complete high voltage MOSFET portfolio in a SOT-223 package worldwide to reduce the overall bill of material (BOM). The CoolMOS comes in 500V, 600V, 650V and 700V in the SOT-223 package which fits to common DPAK fotprints.


The SOT-223 package addresses the need for cost reductions in price sensitive applications; reduced package size maintains compatibility in footprint to the established DPAK package. The usage of a high voltage CoolMOS in a SOT-223 package allows for a direct pin to pin replacement for DPAK in most designs. Almost no thermal limitations are given when using a DPAK footprint for SOT-223.


The thermal behaviour of CoolMOS in the new package was assessed in several applications. When the SOT-223 was placed on a DPAK footprint, the temperature increased by a maximum of 2-3 °C compared to DPAK. The SOT-223 package allows for space savings in designs that are optimised for power density, and where thermal requirements are less critical.