Cortex-A9 processors integrate data-mining features

December 10, 2014 // By Graham Prophet
Toshiba has an ARM Cortex-A9 based application processor series with enhanced sound and image data-mining and security functions, which it intends for use in embedded, handheld devices and industrial equipment.

Three application processors are the latest additions to the ApP Lite ARM Cortex-A9-based TZ2000 series. These are high performance application processors, which support enhanced sound and image data-mining, communications and security functions.

The TZ2100 group devices have 1 MByte of built-in SRAM that supports processing of start-up code and data during program execution without any need for external DRAM. The Cortex-A9 core has 32 kByte L1 cache and 128 kByte L2 cache and an embedded floating point unit (FPU). Power-saving technology enables lengthy data back up and RTC operation with one single coin cell battery. An integrated camera input, 2D graphics engine and LCD controller (WVGA, 60 fps, 24 bit parallel interface) make the devices suitable for applications including panel control. A secure boot system and data encryption function helps protect against data falsifying and hacking.

Recent advances in “big data” (Toshiba adds) are making it easier to sift through huge volumes of data and to develop services that provide users with greater value and convenience. These advances require higher performance application processors that support secure communication and provide timely processing of text, sound and images. TZ2100 group devices can operate at a maximum frequency at 600 MHz. They are suited to use in embedded devices for the Internet of Things (IoT), handheld devices, and industrial equipment.

Toshiba will also have development starter kits for the TZ2100 group, comprising a reference board and device driver. These will support a simple prototype development and evaluation environment for diverse applications. The TZ2100XBG, TZ2101XBG and TZ2102XBG are housed in a 310pin LFBGA package measuring 16 x 16 mm with 0.8 mm pitch. Sample shipments will start from mid-December, with mass production scheduled to start in June 2015.

Toshiba: http://toshiba.semicon-storage.com/ap-en/product/assp/applite/tz2000.html