CUI claims efficiency benchmark with auto compensated digital point of load series in second source footprint

November 13, 2012 // By Paul Buckley
CUI Inc is unveiling a new family of digital point of load dc-dc modules that deliver over 95% peak efficiency in applications employing a distributed power architecture.

The modules, available in 12 A, 25 A, and 50 A versions, are pin and function compatible with the 3E POL BMR46X series from Ericsson Power Modules, a division of Ericsson, which is the world's leading provider of technology and services to telecom operators.  This compatibility enables original equipment makers (OEMs) to address interoperability challenges, reduce time to market, and decrease supply chain risk for these leading-edge digital POL products. 

The modules also incorporate auto compensation, autonomously balancing the trade-offs between dynamic performance and system stability. With this feature, designers are able to bypass the traditional practice of building-in margins to account for factors such as component ageing, manufacturing variations, and temperature, which inevitably lead to higher component cost and longer design cycles.  The NDM2Z’s auto compensation feature allows the module to dynamically set optimum stability in real time as conditions change.  CUI continues to be the only digital point of load module manufacturer in the industry to offer auto compensated products.

The NDM2Z series is the latest addition to CUI’s Novum Advanced Power product line, which targets the most demanding next-generation Information and Communication Technology (ICT) applications. Providing best-in-class efficiency, the NDM2Z 50 A module delivers 91% efficiency at 12 Vdc in to 1.0 Vdc out, 50% load.

The family is available in three compact DIP configurations, a 12 A version measuring 0.827 (L) X 0.500 (W) X 0.284 (H) in., a 25 A version measuring 1.01 x 0.54 x 0.284 in., and a 50 A version measuring 1.215 x 0.79 x 0.36 in. Horizontal SMT and vertical SIP versions are also available.  For added flexibility during the development process, the horizontal DIP and SMT modules are footprint nested to accommodate dual layout needs as power requirements change.

The modules are available with an input range of 4.5~14 Vdc and a programmable output range of 0.6~5.0 Vdc in the 12A version and 0.6~3.3 Vdc in the 25 A and