DDR3, high-performance DIMM sockets for high-density applications

June 05, 2013 // By Graham Prophet
Molex has introduced a range of DDR3 DIMM sockets, which encompasses SMT, through-hole and press-fit mounting techniques, developed to meet the demanding, high-density memory applications found in telecommunication, networking and data systems, advanced computing platforms, industrial controls and medical equipment.

The ultra-low-profile DDR3 DIMM sockets for through-hole mounting feature a lower (1.10 mm) seating plane than standard designs, enabling the use of very low-profile modules with maximum seating heights below 2.80 mm in ATCA* blade systems. It also frees up to 20.23 mm of vertical space above the PCB for the mounting of high-density DIMMs, while maintaining the same design height. The new DDR3 DIMM sockets also feature a low-level contact resistance of 10 m Ω, to support the use of registered DIMM modules (in addition to unregistered DIMMs) and reduce power consumption in blade servers. The halogen-free sockets have a glass-filled, high-temperature nylon housing and latches to enable wave soldering and high-temperature infrared reflow operations.

Designed for multi-processor server chipset applications, the Molex aerodynamic DDR3 DIMM sockets, for press-fit and SMT mounting, feature a streamlined housing to help maximise airflow as well as space and cost savings, while lowering power consumption. The sockets are available in very low profile press-fit (14.26 mm), low profile press-fit (22.03 mm), low profile SMT (21.34 mm) and very low profile SMT (14.20 mm) heights. The ergonomic latch design enables quick actuation and easy removal of high-density memory modules, while the low 2.40 mm seating plane optimises vertical space for more flexible socket module design heights. Freeing up valuable PCB real-estate for higher-density trace routing, the press-fit sockets feature smaller eye-of-needle compliant pins than standard press-fit terminals.

Molex, www.molex.com/link/ddr3.html