Design win; ams foundry technology in Sarda’s Heterogeneous Integrated Power Stage

April 05, 2016 // By Graham Prophet
ams’ foundry know-how and IP has been applied by Sarda Technologies to implement a gate driver IC for ultra-efficient server power stage; ams will manufacture a key component for the power conversion technology with is primarily aimed at data centres

The Full Service Foundry division of ams (Premstaetten, Austria); and power management component supplier Sarda Technologies (Durham, North Carolina), have announced that ams is manufacturing Sarda’s advanced high-voltage CMOS drivers which play a key role in their Heterogeneous Integrated Power Stage (HIPS). Designed to address the rapidly escalating power consumption in data centres, Sarda’s HIPS technology enables the development of voltage regulators that offer fast response, small size and high efficiency for granular power delivery. Sarda’s custom driver is currently being fabricated in ams’ 0.35 µm high-voltage CMOS speciality process, which allows the efficient integration of voltage domains ranging from 3V to 120V on a single monolithic IC.


As part of its comprehensive Full Service Foundry offering, ams supplied its industry benchmark PDK (hitkit) with its fully characterised analogue and digital cell libraries and ESD compliant I/0 libraries for multiple voltage domains. Additionally, ams supported ESD/Latch up design reviews, packaging services, and failure analysis.


“Sarda’s approach of integrating silicon ICs and Gallium Arsenide (GaAs) demonstrates how product developers can use ‘More-than-Moore Scaling’ to significantly improve data centre power management, performance and energy efficiency”, said Markus Wuchse, General Manager of ams Full Service Foundry division.


The Full Service Foundry division of ams has positioned itself in the analogue/mixed-signal foundry market. Its process technology portfolio includes 0.18 µm and 0.35 µm specialty technologies based on ams’ analogue, mixed-signal, High-Voltage and RF processes. The technology offering includes extensions such as 3D integration using Through Silicon Vias, optical filters, back end process customisation, 3D-WLCSP and many more.