Dialog Semiconductor has disclosed that Le Mobile & Information Technology (Beijing), is packaging with its recently launched Le Max and Le 1 Pro smartphones, power adapters that contain Dialog’s iW1780 Qualcomm Quick Charge 2.0 adapter chipset.
The iW626 Rapid Charge interface IC resides on the secondary side of the AC/DC charger power supply and works with Dialog’s iW1780 PrimAccurate primary-side digital pulse width modulation (PWM) controller. The iW1780 uses a unique secondary-to-primary digital communication link signal to receive all Rapid Charge commands from the iW626 through a single optocoupler. The iW626+iW1780 chipset supports Quick Charge 2.0 High Voltage Dedicated Charging Port (HVDCP) Class A (5V, 9V, 12V output) applications, providing fast voltage transition and low no-load power consumption under 100 mW.
Dialog’s SmartDefender advanced hiccup technology in the iW1780 provides an adapter safety feature that protects mobile devices from heat damage caused by short circuits in dirty or damaged charging ports, or by worn USB cables and connectors. The iW1780 PWM controller’s SmartDefender protection reduces the average power delivered to a short circuit by up to 75% without latching off. This helps prevent excessive heat build-up and damage for safer, more reliable rapid charging – all with no added components.
Founded in 2015, Le Mobile & Information Technology (Beijing) Co is a subsidiary under LeTV Holdings. Le Mobile has introduced the world’s first ecosystem mobile phone brand – Le Superphone, including three flagship products: Le 1 Pro, Le Max, and Le 1. The Le Max is a high end device with a 6.33-inch Quad HD display, Snapdragon 810 chip (2 GHz, octa-core, 64-bit), 4 GB of LPDDR4 RAM, up to 128 GB of internal storage, and a 21-megapixel f/2.0 camera with optical stabilisation and true-tone flash. The Le Max also has an ESS Hi-Fi chip, a one-touch fingerprint reader, infrared remote, a 3,500 mAh battery, dual LTE SIM support and Wireless HD display link. The Le 1 Pro is smaller