Distributor Silica adds Huawei wireless modules as part of M2M/IoT programme

February 27, 2015 // By Graham Prophet
Silica has announced a franchise agreement with Huawei; Silica is marketing multi-standard 3G and 4G wireless modules in a number of form factors, including LGA, PCIe and PCI-SIG M.2. Based on Huawei HiSilicon chipset technology, the new modules offer features specific for M2M communication.

Silica provides in-depth technical support including software support for Huawei modules for their ArchiTech evaluation boards. Silica has indicated that it intends to offer a full range of M2M and IoT-oriented connectivity products, including sourcing cost-effective air-interface tariffs and connective options that will ensure that wireless data links can be maintained in all circumstances.

M2M communications and wider Internet of Things (IoT) applications demand low power, high reliability wireless links. Where cellular radio networks are employed, certified products that support multiple standards and operators are preferred, allowing for networks updates and minimising inventory if the same products are to be used in more than one country. Huawei modules support over 90% of operators worldwide. The boards also feature mini PCIe connectors and SIM cardholders.

Even though lower data rates may be adequate for many of today’s M2M applications, 3G (HSPA/HSPA+) is now becoming the dominant standard and 4G (LTE/LTE-A) networks are being rolled out rapidly. In the near future, increasing numbers of 2G networks will be phased out. As a result, designers need to specify 3G or dual-standard 3G/4G modules to ensure that products have a long operating life.

Silica; www.silica.com