At the same time, Sundance has announced that the SMT166 has been chosen as the prototyping platform for the European Union’s FP7 FlexTiles 3D SoC project, a key research project into self-adaptive, high-performance computing.
Headed by Thales Research & Technology, The EU FP7 FlexTiles project is focused on the challenge of exploiting multicore technology to develop energy-efficient, high-performance compute systems. The project will define and develop a programmable, heterogeneous, many-core 3D SoC architecture. The many-core layer, which will integrate GPP and DSP cores, will be associated with an innovative, reconfigurable virtualisation layer, featuring a self-adaptive FPGA fabric in an interchangeable-tiles concept; and a dedicated tool-flow to improve programming efficiency, reduce the impact on time-to-market and reduce the development costs by 20% to 50%. Sundance’s SMT166 will be used initially to develop, validate and verify the tools to create the FlexTiles 3D SoC. Subsequently, users will be able to use the SMT166 as an R&D platform to innovate and prototype products based on the FlexTiles 3D SoC.
The SMT166, which can be integrated into a standard 19-inch rack, is designed around two Xilinx Virtex-6 FPGAs. Each FPGA is responsible for routing data to and from half the Sundance Local Bus (SLB) connections on the board. In addition, parallel and serial connections are available for inter-FPGA communications. The SMT166 supports up to four SLB mezzanine modules with a wide range of low-cost options available from Sundance such as a multi-ADC system with 16x channels of 14-bit, 250 MHz ADC inputs; an octal channel SDR platform; or a complete MIMO 8 x 8 RF transceiver setup. The SMT166 supports Sundance’s 12-core DSP module which provides over 10,000 MIPS of fixed point DSP processing power. An optional interface to FMC modules allows users to select from a range of add-on modules to suit a wide variety of applications. Each FPGA on the SMT166 is coupled with two banks of DDR3 memory and also