Dual-packaged MOSFETs for load switching in mobile devices

May 06, 2016 // By Graham Prophet
Offering low on-resistance and heat dissipation in compact packages, Toshiba Electronics’ 2-in-1 MOSFETs – the SSM6L61NU and SSM6N61NU – are contained in SOT-1118 (UDFN6) packages, and feature RDS(ON) of 25 mΩ (typ.) @N-ch, VGS=4.5 V.

As well as mobile devices, the parts can be used in battery management applications and for load switching in applications with USB Type-C interfaces. With N-ch ON-resistance of 25 mΩ, the MOSFETs contribute to reduced power loss in power supplies and extend the operation time of battery-driven devices. The SSM6L61NU is a complementary device and the SSM6N61NU is a dual N-ch device. When used in applications with USB Type-C interfaces the SSM6L61NU and SSM6N61NU can be placed between the Vout (output voltage) from the power management IC and system-on-a-chip (SoC), or in other parts of the circuitry. The package measures 2 x 2 mm, and the power dissipation rating is PD=1W; footprint of the MOSFETs is 50% that of parts housed in a PS-8 package.


Toshiba Electronics Europe; www.toshiba.semicon-storage.com