The products integrate NAND chips fabricated with 15 nm process technology with a controller to manage basic control functions for NAND applications, in a single package. Toshiba’s previous product group of e∙MMC are rated for an operating temperature range of -40 to +85°C, for example, for infotainment applications. The new products support applications such as instrument clusters that require e∙MMC storage solutions to operate at higher temperatures up to +105°C.
The JEDEC e∙MMC Version 5.1 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products. Additionally, new features standardized in JEDEC e∙MMC Version 5.1, such as BKOPS control, Cache Barrier, Cache Flushing Report, Large RPMB Write and Command Queuing, are applied to the new products to enhance usability. “BKOPS control” is a function where the host allows the device to perform background operation when the device is idle. “Cache Barrier” is a function that controls when cache data is written to the memory chip. “Cache Flushing Report” is a function that informs the host if the device’s flushing policy is FIFO (First In First Out) or not. “Large RPMB write” is a function that increases the data size that can be written to the RPMB area to 8KB.
Toshiba is also developing automotive UFS (Universal Flash Storage) products that support AEC-Q100.
Toshiba Electronics Europe; www.toshiba.semicon-storage.com