HOZOX absorption technology employs a unique dual-layer design to maximise the EMI noise mitigation performance. The magnetic layer’s powder composite absorbs lower frequency electromagnetic energy, while the conductive layer’s powder and high loss dielectric resin absorb high frequency electromagnetic energy. The products feature a very thin form factor and come in two different tape formats as well as an A4 sheet format, all of which can be easily die-cut to specific configurations.
The dual-layer structure of HOZOX technology absorbs both MHz- and GHz-range electromagnetic energy effectively to provide ultra-wideband EMI noise mitigation. HOZOX absorption tape and sheets are insulated on one side, so they can be placed in contact with any low-power active component such as noisy digital or analogue integrated circuits. While HOZOX technology converts a portion of the electromagnetic waves it absorbs into heat, the amount is minimal and does not adversely affect temperature rise in the end unit. HOZOX technology is lead-free with RoHS 2011/65/EU compliance and UL 94V-0 equivalent for flammability.
High-frequency noise continues to be a growing problem due to the trend of packing more functions into increasingly smaller designs, and with the increased operating frequencies of integrated circuits. “While noise might be controlled at the board level, secondary interference can cause functional faults, especially when multiple boards are connected through a bus or mounted together. Sometimes the noise even exceeds limits defined in Federal Communications Commission or other industry regulations,” said Joe Falcone, product manager, Molex. “This means there’s a growing need for EMI noise-suppression solutions that can act to absorb broadband-radiated noise.”