Countless safety systems in cars and trucks now depend on the continuous high-level functionality of interconnected electronic components, often positioned in areas that are exposed to wide temperature variations, to oils and greases, to moisture, dust, stone impacts, and vibrations. For these reasons, it is important that, wherever possible, electronic and electrical components are securely protected from the environment. Otions include;
- Technomelt low-pressure mouldable hot-melt polyamides for encapsulation of plugs, sockets, and sensors;
- Loctite acrylic impregnation resins for sealing microscopic gaps in metal/plastics hybrid components;
- Thermally conductive potting resins for electric propulsion components.
Low-pressure hot-melt polyamide encapsulation; in the low-pressure hot-melt moulding technique, resin is injected around components fixed in a closed mould. The hot-melt serves as an encapsulant and also as a housing, so there is no need for a separate shell to protect the components. Once the hot-melt material has cooled and solidified, the components are ready for further processing.
Resins for hot-melt moulding are single-component polyamide systems that can be used in simple and clean production processes. These processes take up little floor space, they are fast and energy-efficient.
Technomelt hot-melt moulding materials provide high humidity resistance, temperature resistance up to 150°C, and impact resistance down to -50°C: other polyamide hot-melts, the company says, can often be used in environments of up to only 120°C and are more prone to hydrolysis.
The new materials from Henkel provide new opportunities for higher temperature applications in humid environments, such as sensors in door handles, rear view cameras, batteries or tyre pressure monitoring systems, or for sealing aluminium cables.
Sealing gaps with acrylic impregnation; acrylic impregnation products such as Loctite IS 5100 provide a sealing solution for electrical and electronic components. Microscopic voids are inherent in many electronic assemblies that combine metal and plastics elements. Over time in the field, these voids can cause product failures, so it is important that