For precise analysis of simulated temperature profiles, the latest version of ThermaSim has been enhanced with a number of key features such as temporal zooming of die temperature with respect to power, and the ability to define more real-world conditions for increased simulation accuracy and design reliability, while simplifying the user experience.
While other thermal simulation tools offer package-level averages, ThermaSim is created using finite element analysis (FEA) techniques for increased accuracy. The free online tool is especially useful in high-current, high-temperature applications such as automotive, fixed telecom, desktop and laptop computer, and industrial systems. The latest version is also ideal for applications with tight design margins and those subject to transient conditions, including UIS (unclamped inductive switching) and automotive load dump.
ThermaSim helps designers reduce time to market by allowing detailed thermal simulations of Vishay Siliconix power MOSFETs, ICs, and DrMOS products to be performed before prototyping.
More information about the ThermaSim 3.0 at www.vishay.com/doc?49641