Espros launches QVGA 3D time-of-flight sensor

December 01, 2014 // By Peter Clarke
Espros Photonics AG (Sargan, Switzerland) has announced the EPC660, a 3D time-of-flight QVGA imager that offers backside illumination and high sensitivity to near-infrared light.

The image sensor has a 320 by 240 CCD pixel field and includes control logic to operate the device. Some 66 full frame ToF images are delivered which can be increased to more than 1,000 ToF images.

All configuration is one via an I 2C interface and an integrated EEPROM holds factory settings and production and configuration data. The sensor includes an integrated LED driver capable of driving more than 200mA peak current.

The epc660 QVGA ToF image on chip carrier module. Source: Espros.


Depending on the system design the sensor can provide millimeter resolution of distance at up to 100 metres. The high sensitivity of the optical front end allows for reduced IR illumination and thereby reduces overall power consumption. The CCD pixel architecture can tolerate ambient light levels of up 130kLux making the sensor suitable for use outdoors.

Espros (Switzerland) ;