First 20nm SoC product shipped, says Xilinx

November 12, 2013 // By Graham Prophet
The era of 20-nm silicon – outside of high-end processors – has become more “real” with Xilinx' announcement that it has despatched the first UltraScale ASIC-class programmable architecture parts to a customer.

Xilinx says that this customer shipment is the semiconductor industry’s first such 20nm product, manufactured by TSMC, and the PLD industry's first 20nm All Programmable device. Xilinx UltraScale devices aim to deliver an ASIC-class product using an ASIC-like programmable architecture coupled with the Vivado ASIC-strength design suite and the company's UltraFast design methodology. The UltraScale devices claim1.5X – 2X more “realisable” system-level performance and integration.

“The delivery of UltraScale devices on TSMC’s 20nm process technology marks a new juncture for the semiconductor industry,” said TSMC vice president of R&D, Dr. Y.J. Mii.

Xilinx UltraScale devices enable next generation smarter systems with new high-performance architectural requirements for applications such as 400G OTN, packet processing and traffic management, 4X4 Mixed Mode LTE, WCDMA Radio, 4K2K and 8K displays, Intelligence Surveillance and Reconnaissance (ISR), and high-performance computing applications for the data centre.

Xilinx supplied these samples to advanced (lead) customers and says that it will have general sampling beginning in the first quarter of 2014.