Fujitsu’s Bluetooth 4.2 low energy module hosts Nordic silicon

August 05, 2016 // By Graham Prophet
The FWM7BLZ20 Smart Module is now in sample availability; the module is based on the Nordic Semiconductor nRF52 SoC and comes with an integrated antenna, together with all necessary certification to speed taking an application to market.

The module achieves about half of the power consumption (about 5.4 mA: actual measured value) and about double the transmission distance at a receiving sensitivity of -94 dBm (actual measured value) in comparison to the Bluetooth v4.1 modules Fujitsu has on the market. The embedded nRF52832 QFN-package SoC has been designed around a 32-bit ARM Cortex-M4F CPU with 512 kB FLASH and 64 kB RAM. Fujitsu places this chip into an outline of 15.7 x 9.8 x 1.7 mm (same size as the MBH7BLZ02-series).


32 MHz crystal oscillator and the 32.768 kHz crystal oscillator are both integrated, leaving all 30 GPIOs available for development. NFC-A tag support is included on chip. Out-of-Band (OOB) pairing using NFC simplifies the process of authenticated pairing between two Bluetooth devices by exchanging authentication information over an NFC link.


The new module is on air compatible with the nRF51-series modules. And as the FWM7BLZ20 module has the same pad pattern, it is with a few minor changes pin-to-pin compatible with the MBH7BLZ02-series.


Fujitsu Components has a dedicated design team on antenna development able to create a perfect match between module capabilities and proven antenna quality, as previously used on the MBH7BLZ02. The FWM7BLZ20-109049 module will be FCC/IC/CE/Japan radio ACT certified when going into production September 2016.


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