GalaxyCore develops 'through-silicon' image sensor

November 24, 2014 // By Peter Clarke
Fabless image sensor company GalaxyCore Inc. (Shanghai, China), which was ranked in the top ten image sensor vendors in 2012, has announced it has developed a technology called Through-Silicon-Illumination (TSI).

The technology is suitable for image sensors with pixel sizes of 1.75-micron down to 1.1-micron and could be extended down to 0.9-micron pixels, GalaxyCore said.

The technology brings several advantages: improved sensitivity and signal-noise ratio with reduced thermal noise, dark current, and crosstalk; high-speed and low power, allowing higher frame rates; simpler and lower-cost manufacturing based on fewer process steps.

GalaxyCore said it expects to launch 5- 8- and 13-megapixel image sensor products utilizing this technology in 2014 and 2015. It uses a 90nm logic process made for the company by Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) and will begin volume production of sensors based on the technology shortly, GalaxyCore said.

GalaxyCore, founded in 2003, owns intellectual property associated with TSI including the analog design, pixel layout, and pixel-related process technology.

"We will promptly launch 5-megapixel, 8-megapixel and 13-megapixel image sensors utilizing this TSI technology with 1.1 to 1.4-micron pixel size in the next a few months,: said GalaxyCore CEO Zhao Lixin, in a statement. "We dedicate to offer high performance and cost efficient world-class image sensors products for the fast-growing market of mobile devices such as smartphones and tablets."

Slideshare gives a snapshot of GalaxyCore business up to February 2014.

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